Dynamic PMUTs Packaging Using Shape Memory Alloy

Abstract: 

This work proposes a dynamic package scheme for piezoelectric micromachined ultrasonic transducers (PMUTs) by a Shape Memory Alloy (SMA) controlled platform to actively change the acoustic wave directivity patterns and frequency responses. Innovations include: (1) a shape-morphing package capable of switching between two states in seconds using SMA Nitinol wires; (2) a 278% increase in the received signal at 50 kHz between two states at an 45° angle; and (3) a design scheme by generative and surrogate machine learning models for optimal parameters according to desired outputs. The dynamic package enables designated acoustic fields across different frequencies for potential applications in ultrasonic communication, medical imaging, and environmental sensing.

Publication date: 
January 13, 2025
Publication type: 
Conference Paper (Proceedings)
Citation: 
M. Teng et al., "Dynamic PMUTs Packaging Using Shape Memory Alloy," 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS), Kaohsiung, Taiwan, 2025, pp. 1011-1014, doi: 10.1109/MEMS61431.2025.10917548. keywords: {Micromechanical devices;Ultrasonic transducers;Ultrasonic imaging;Shape memory alloys;Wires;Pipelines;Packaging;Sensors;Acoustic field;Biomedical imaging;MEMS;PMUT;ultrasound;packaging;machine learning;neural network;shape memory alloy},