Roger T. Howe (Advisor)

RTH/TJK2: As-Grown SiGe Thin Film with Low Stress and Low Strain Gradient

Blake C.-Y. Lin
2003

Monolithic integration of MEMS devices with driving and controlling electronics is advantageous for improving performance and lowering cost. Polycrystalline silicon-germanium (poly-SiGe), which has mechanical and electrical properties similar to poly-Si, is a promising candidate for the structural-layer material of post-CMOS integration of MEMS because poly-SiGe can be deposited at much lower temperatures than poly-Si. While low-resistivity poly-SiGe can be easily obtained utilizing in-situ p-type (i.e. boron) doping during deposition, poly-SiGe films deposited at temperatures lower...

JSS1/RTH: Fluidic assembly of RF receiver with glass-substrate inductors & antenna

Jack Peng
2003

The goal of this project is to use fluidic self-assembly to integrate RF CMOS chiplets onto micro-machined wells in glass. Because an insulator(glass) is used as the substrate, a high Q-factor of the inductor is expected. Another advantage is the low parasitic interconnects associated with the fluidic self-assembly process.

Project end date: 08/22/03

RTH30: Micromachined Electrodes for Capacitive Sensors

Noel Arellano
2003

The goal of this project is to develop and batch fabricate a very precise electrode for a high performance capacitive sensor using microfabrication techniques.

Project end date: 02/06/04

RTH32: Fluidic Microassembly for Microfluidic Applications

Frank Zendejas
2003

The project encompasses the extension of capillary-based fluidic self-assembly [1] to the assembly of silicon microparts on polydimethylsiloxane (PDMS).

Project end date: 02/09/04

RTH31: Electrical Interconnect of Components Transferred by Fluidic Microassembly Using Capillary Forces

Karen L. Scott
2003

The overall objective of this project is to extend the understanding of the fluidic microassembly technique using capillary forces. Specifically, the focus has been to obtain single to multiple electrical interconnects between microcomponents and the substrate.

Project end date: 02/10/04

RTH41: Nanoresonator Interface Electronics

Peter (Jeng-Wen) Chen
2003

The output of nanoresonators is often in the form of small currents, in the range of nanoamperes. We will investigate methods to improve the extraction and amplification of these small signals, in the presence of feedthrough and other parasitic effects. With optimized sensing circuits, one can also investigate a variety of ideas utilizing nanoresonator structures. Currently on our list are: 1. Novel methods to minimize feedthrough in nanoresonator structures. 2. HF filters from mechanically-coupled nanoresonators 3. Demonstration of an associative memory from variable coupling of...

RTH44: Self-Healing RF MEMS Switch

Rishi Kant
2005

The objective of this project is to create an RF MEMS switch with the capability of self-healing in order to perform hot switching of large currents. Traditional electrostatic actuation is used for closing the switch. Liquid Gallium is used for making contact thus alleviating the problem of thermal and mechanical deformation due to hot switching. The liquid droplets are confined to a distinctive pattern by exploiting the different wetting affinities that gallium has to different materials. Thermally vaporized gallium is reclaimed during the closing of the switch. The benefits derived...

RTH39: Post-process of GHz-range SiGe Resonators Over Standard RF CMOS Circuitry for Transceiver Applications

Emmanuel Quevy
2005

While MEMS resonators are about to demonstrate their potential for future transceiver architectures, the need for low parasitics low power performances implies shrinkage towards fully integrated systems. The preliminary goal of this project is to provide access to a post-process scheme of SiGe structures that enables integration of GHz resonators with Deep-Submicron CMOS RF ICs available from commercial vendor.

Project end date: 08/31/05

RTH40: Effects of Boron Concentration on Si1-xGex Properties for Integrated MEMS Technology

Marie-Ange Eyoum
2005

Because of its low thermal budget that allows to fabricate MEMS micromachined structures directly on top of electronics, SiGe MEMS technology remains very attracting for the monolithic integration of MEMS with CMOS [1]-[3]. In this scheme, p+Ge would replace Silicon dioxide as the sacrificial layer while p+ SiGe would replace poly Silicon as the structural layer.

Project end date: 09/01/05

RTH/JDK2: Biomimetic Nanofabrication of Silica Structures Based on Diatoms

William J. Holtz
2006

Diatoms are a type of brown algae that create hydrated silicon-dioxide structures with feature sizes down to 5 nm at ambient temperature and pressure. The goal of this project is to replicate these processes in vitro and then manipulate the process parameters to create engineered structures.

Project end date: 01/09/06