RTH31: Electrical Interconnect of Components Transferred by Fluidic Microassembly Using Capillary Forces


The overall objective of this project is to extend the understanding of the fluidic microassembly technique using capillary forces. Specifically, the focus has been to obtain single to multiple electrical interconnects between microcomponents and the substrate.

Project end date: 02/10/04

Karen L. Scott
Publication date: 
August 8, 2003
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2003

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