The goal of this project is to use fluidic self-assembly to integrate RF CMOS chiplets onto micro-machined wells in glass. Because an insulator(glass) is used as the substrate, a high Q-factor of the inductor is expected. Another advantage is the low parasitic interconnects associated with the fluidic self-assembly process.
Project end date: 08/22/03
February 21, 2003
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2003