Package, Process & Microassembly

Research that includes:

  • Low temperature MEMS-on-CMOS Silicon-Germanium process for adding MEMS to finished CMOS wafers or dice
  • Silicon Carbide process for adverse environment MEMS and high frequency RF resonators
  • Localized bonding: eutectic, fusion, solder, laser, inductive, rapid thermal processing, and ultrasonic; suitable for device level or wafer level packaging or sealing applications to plastic, glass, silicon and Bio materials, including liquid encapsulation
  • Fluidic microassembly for post-process combining of dissimilarly processed microdevices
  • Carbon nanotube and silicon nanowire directional growth in post-process, low ambient temperature environments
  • Stiction mitigation for MEMS

BPN427: Hermetic Bonding for Optical Feed-through

Koo Hyun Nam
Jiyoung Chang
2010

Optical packaging differs from traditional packaging in several ways, and many of these differences emerge from the need to protect the electrical, mechanical, and optical components of a system while preserving its exposure to the environment. Thus, the materials and packaging processes involved in such a system must be chosen with these goals in mind. This research project seeks to ascertain reliable and feasible hermetic packaging methods to ensure mechanical durability as well as insulation from electrical leakage for an optical feed-through operating in highly variable...

BPN362: MEMS Supercapacitor

Yingqi Jiang
2011

Employing the Electrochemical Double Layers (EDL) phenomenon and porous electrode materials, the supercapacitor have an astonishing high specific capacitance, typically on the order of thousands of times greater than common capacitors. In this project, thanks to MEMS technology, we have for the first time brought the supercapacitor concept into micro scale. Different from its sandwich-like macro scale configuration, a novel planar structure has been proposed and implemented. This device has the wide potential applications such as micro power sources and circuitry components with...

LWL20: CMOS-Compatible Synthesis of Carbon Nanotubes for Sensor Applications

Bao Quoc Ta
Quoc-Huy Nguyen
Heather Chiamori
2012

The goal of this project is to develop a microelectronics-compatible synthesis method and direct integration of carbon nanotubes into MEMS and CMOS for sensors applications. Electrical process control, compatible with automation and wafer-level production, has been implemented. The project is partially carried out within the collaboration program between Vestfold University College (Norway) and UC Berkeley which is funded by The Norwegian Centre for International Cooperation in Higher Education (SIU).

Project end date: 08/14/12

BPN317: Direct-Write Piezoelectric PVDF Nanogenerator via Near-Field Electrospinning

Jiyoung Chang
Michael Dommer
2012

This project aims to study energy conversion and actuation properties of a new architecture electrospun piezoelectric nanofibers. It presents interesting potentials in various applications including power scavenge, sensing and actuation. Conceptually, we propose an in-situ stretching and poling process for the production of piezoelectric PVDF nanofibers using the "continuous near-field-electrospinning" process. Preliminary results conclude that location and pattern deposition control of continuous NFES are achievable for large area depositions of nanofibers. In this project, we will...

BPN570: Large Area Semi-Permeable Encapsulation Membranes Using Carbon Nanotube Composites

Armon Mahajerin
2012

The primary goal of this project is to develop a unique composite layer with carbon nanotubes to achieve both the release and encapsulation of devices fabricated on silicon wafers for large area applications. Previously, permeable polysilicon has been used for this purpose, but this process requires multiple, lengthy process steps in order to generate permeability. A composite membrane of carbon nanotubes and polysilicon may achieve desired permeability for sacrifical etching of underlying oxides, followed by low pressure chemical vapor deposition to seal the fabricated device in...

BPN681: HEaTS: High Temperature Bonding Technology for SiC Devices - Au-Sn SLID

Torleif Andre Tollefsen
Matthew Chan
2012

Au-Sn solid-liquid-interdiffusion (SLID) bonding is a novel and promising Interconnect technology for high temperature (HT) applications. In combination with Silicon Carbide (SiC) devices, Au-Sn SLID has the potential of being a key technology for the next generation of innovative, cost effective and environmentally friendly drilling and well intervention systems for the oil industry. However, limited knowledge about Au-Sn SLID bonding for HT applications is a major restriction to fully realize the high temperature potential of SiC devices. A uniform Au-rich Au-Sn bond interface is...

BPN413: HEaTS: Bonding of SiC MEMS Sensors for Harsh Environments

Matthew W. Chan
2013

Silicon Carbide (SiC) Sensors are appealing for harsh environment MEMS applications, specifically because of their stability in corrosive environments and their ability to withstand high temperatures. The long range goal of this project is to develop a robust process to bond SiC sensors to various metal components in a way that will avoid disrupting high-precision measurements of strain, acceleration, pressure, and temperature in high-temperature, high-pressure, corrosive environments. Traditional bonding methods such as soldering, brazing, and welding are not suitable for joining...

BPN734: Package-Derived Influences on Micromechanical Resonator Stability

Divya N. Kashyap
2015

Vacuum encapsulation of RF disk and beam resonators is necessary in order to maintain high Q and frequency stability. However, the difference in the coefficient of thermal expansion of the package material and the substrate lead to package induced stress. This project aims to explore the effects of this stress on the frequency response of the resonators using finite element analysis (FEA) software. Simulations performed on resonators packaged using conventional hermetic encapsulation techniques such as anodic and fusion bonding will be compared to that of an in situ packaging method...

BPN712: Bridging Research-to-Commercialization Gaps In an Industry/University Ecosystem

John Huggins
Hossain M. Fahad
Hiroshi Shiraki
David Burnett
Nicola Accettura
2015

Some BSAC members have, in our surveys and at IAB meetings, vocalized that we need to help bridge commercialization gaps and increase the speed of commercialization. Traditional University research commercialization paths through passive licensing to start-ups, are often highly successful and will remain the dominant path. But such paths do not leverage the sophisticated manufacturing, marketing, and sales channels of our larger Industrial members who could rapidly exploit certain research discoveries. While any such commercialization facilitation programs cannot compromise the...

BPN480: AM Fitzgerald: MEMS Design, Prototyping, Modeling, Failure Prediction, and Foundry Transfer

Alissa M. Fitzgerald
2015

Since 2003, A.M. Fitzgerald & Associates has been a key development partner to over 125 clients around the world, ranging in size from startups to Fortune 100 companies. Our team of experts develops all types of MEMS sensors and actuators for applications in the consumer electronics, medical devices, industrial, aerospace, and scientific markets. MEMS devices designed and developed by AM Fitzgerald are helping to save lives, improve quality and safety of life, and reduce waste and inefficiency in industrial processes. Our capabilities include: MEMS/Microsystems design, simulation...