BPN491: SiC TAPS: Ion Beam Deposited SiC for MEMS Encapsulation


This project seeks to create a harsh environment encapsulated strain sensor useful in high temperature and high shock environments.

Project end date: 08/11/10

David R. Myers
Publication date: 
February 8, 2010
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2010

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