The primary goal of this project is to develop a unique composite layer with carbon nanotubes to achieve both the release and encapsulation of devices fabricated on silicon wafers for large area applications. Previously, permeable polysilicon has been used for this purpose, but this process requires multiple, lengthy process steps in order to generate permeability. A composite membrane of carbon nanotubes and polysilicon may achieve desired permeability for sacrifical etching of underlying oxides, followed by low pressure chemical vapor deposition to seal the fabricated device in vacuum. This process provides an efficient, reliable alternative to wafer bonding packaging techniques and also enables larger areas to be sealed compared to other thin film processses.
Project end date: 08/16/12