Package, Process & Microassembly

Research that includes:

  • Low temperature MEMS-on-CMOS Silicon-Germanium process for adding MEMS to finished CMOS wafers or dice
  • Silicon Carbide process for adverse environment MEMS and high frequency RF resonators
  • Localized bonding: eutectic, fusion, solder, laser, inductive, rapid thermal processing, and ultrasonic; suitable for device level or wafer level packaging or sealing applications to plastic, glass, silicon and Bio materials, including liquid encapsulation
  • Fluidic microassembly for post-process combining of dissimilarly processed microdevices
  • Carbon nanotube and silicon nanowire directional growth in post-process, low ambient temperature environments
  • Stiction mitigation for MEMS

BPN361: MiNaSIP 2.C.1: MEMS Packaging Beyond Glass Frit

Jiyoung Chang
2009

Glass frit bonding is a largely popular method of encapsulating MEMS devices in the industry today. It's popularity is due to relatively low processing temperature, tunability of thermal coefficient of expansion, and hermetic sealing. However, glass frit bonding requires a large amount of space, sometimes as much as several times the size of the MEMS device itself. This attribute is largely responsible for limiting further scalability and miniaturization of individual dies. This research project aims (1) to take a deeper look into the shortcomings of the existing glass frit bonding...

BPN491: SiC TAPS: Ion Beam Deposited SiC for MEMS Encapsulation

David R. Myers
2010

This project seeks to create a harsh environment encapsulated strain sensor useful in high temperature and high shock environments.

Project end date: 08/11/10

BPN402: MiNaSIP 2.C.2: Zero-Stress MEMS Packaging

Chen Yang
Bin Zhang
Ryan Sochol
2010

Tools for linking the environment (application/tester/customer system) with the micro world of a MEMS device are extremely limited. It has proven difficult to accurately predict package, tester, and circuit board interactions and results. Thus, this research aims (1) to explore the physics of micro/macro interfacial contacts/stresses in the back-end packaging process to the overall MEMS RF device performances, and (2) to develop models for stresses in packages with MEMS devices (including RF MEMS such as QFN, LGA, cavity packages, etc.) both in process and final product stages. The...

BPN315: Rapid Synthesis of Nanostructures via Induction Heating

Brian D. Sosnowchik
2010

The primary objective of this work is to develop a platform technology for the rapid synthesis nanostructured materials using an induction heating system. The technology is clean, scalable, inexpensive and versatile, and may be used to rapidly synthesize a wide range of nanomaterials in a room-temperature environment in as little as 30 seconds. Such a synthesis technology may be used to quickly prototype novel and existing vapor-liquid-solid-grown nanomaterials for sensor applications, and open up a new class of nanomaterial synthesis.

Project end date: 08/11/10

BPN427: Hermetic Bonding for Optical Feed-through

Koo Hyun Nam
Jiyoung Chang
2010

Optical packaging differs from traditional packaging in several ways, and many of these differences emerge from the need to protect the electrical, mechanical, and optical components of a system while preserving its exposure to the environment. Thus, the materials and packaging processes involved in such a system must be chosen with these goals in mind. This research project seeks to ascertain reliable and feasible hermetic packaging methods to ensure mechanical durability as well as insulation from electrical leakage for an optical feed-through operating in highly variable...

BPN362: MEMS Supercapacitor

Yingqi Jiang
2011

Employing the Electrochemical Double Layers (EDL) phenomenon and porous electrode materials, the supercapacitor have an astonishing high specific capacitance, typically on the order of thousands of times greater than common capacitors. In this project, thanks to MEMS technology, we have for the first time brought the supercapacitor concept into micro scale. Different from its sandwich-like macro scale configuration, a novel planar structure has been proposed and implemented. This device has the wide potential applications such as micro power sources and circuitry components with...

LWL20: CMOS-Compatible Synthesis of Carbon Nanotubes for Sensor Applications

Bao Quoc Ta
Quoc-Huy Nguyen
Heather Chiamori
2012

The goal of this project is to develop a microelectronics-compatible synthesis method and direct integration of carbon nanotubes into MEMS and CMOS for sensors applications. Electrical process control, compatible with automation and wafer-level production, has been implemented. The project is partially carried out within the collaboration program between Vestfold University College (Norway) and UC Berkeley which is funded by The Norwegian Centre for International Cooperation in Higher Education (SIU).

Project end date: 08/14/12

BPN317: Direct-Write Piezoelectric PVDF Nanogenerator via Near-Field Electrospinning

Jiyoung Chang
Michael Dommer
2012

This project aims to study energy conversion and actuation properties of a new architecture electrospun piezoelectric nanofibers. It presents interesting potentials in various applications including power scavenge, sensing and actuation. Conceptually, we propose an in-situ stretching and poling process for the production of piezoelectric PVDF nanofibers using the "continuous near-field-electrospinning" process. Preliminary results conclude that location and pattern deposition control of continuous NFES are achievable for large area depositions of nanofibers. In this project, we will...

BPN570: Large Area Semi-Permeable Encapsulation Membranes Using Carbon Nanotube Composites

Armon Mahajerin
2012

The primary goal of this project is to develop a unique composite layer with carbon nanotubes to achieve both the release and encapsulation of devices fabricated on silicon wafers for large area applications. Previously, permeable polysilicon has been used for this purpose, but this process requires multiple, lengthy process steps in order to generate permeability. A composite membrane of carbon nanotubes and polysilicon may achieve desired permeability for sacrifical etching of underlying oxides, followed by low pressure chemical vapor deposition to seal the fabricated device in...

BPN681: HEaTS: High Temperature Bonding Technology for SiC Devices - Au-Sn SLID

Torleif Andre Tollefsen
Matthew Chan
2012

Au-Sn solid-liquid-interdiffusion (SLID) bonding is a novel and promising Interconnect technology for high temperature (HT) applications. In combination with Silicon Carbide (SiC) devices, Au-Sn SLID has the potential of being a key technology for the next generation of innovative, cost effective and environmentally friendly drilling and well intervention systems for the oil industry. However, limited knowledge about Au-Sn SLID bonding for HT applications is a major restriction to fully realize the high temperature potential of SiC devices. A uniform Au-rich Au-Sn bond interface is...