Package, Process & Microassembly

Research that includes:

  • Low temperature MEMS-on-CMOS Silicon-Germanium process for adding MEMS to finished CMOS wafers or dice
  • Silicon Carbide process for adverse environment MEMS and high frequency RF resonators
  • Localized bonding: eutectic, fusion, solder, laser, inductive, rapid thermal processing, and ultrasonic; suitable for device level or wafer level packaging or sealing applications to plastic, glass, silicon and Bio materials, including liquid encapsulation
  • Fluidic microassembly for post-process combining of dissimilarly processed microdevices
  • Carbon nanotube and silicon nanowire directional growth in post-process, low ambient temperature environments
  • Stiction mitigation for MEMS

BSAC4: DRIE Process Optimization for Very Smooth Sidewall Etch

Ning Chen
2004

Long term goal for this project is to develop a robust deep reactive ion etch process for a smooth sidewall through wafer etching, while maintaining a straight profile, good etch rate, and reasonable selectivity.

Project end date: 01/20/05

LWL29: Nano-Getters for MEMS Applications

Daoheng Sun
Dane Christensen
2005

High vacuum inside a micro-cavity is hoped to be obtained and maintained for lifetime of a MEMS. This project will supply design rules of getter dimensions in MEMS packaging by exploring the relationships of the residual gas pressure and its variety in a cavity with (1) the different getter materials, such as Ti, Zr, V, and their mixture, (2) the surface area, thickness, and amount of the getter deposited respectively. Multi-times activating the getter by means of localized heating to improve the efficiency of it. Develop nano-getter with high porosity and large surface area. Design...

LWL18: Integration of NEMS and MEMS by Localized Growth of Nanowires

Ongi Englander
2005

Integrated manufacturing of nano-to-micro systems is critical for the practical applications of nanotechnology. This research project aims (1) to develop and characterize an integrated manufacturing process to connect nanostructures with micro scale systems and (2) to utilize the integrated structure for practical sensing applications.

Project end date: 08/31/05

KSJP33a: Tools for Microassembly

Subramaniam Venkatraman
2005

Complex three dimensional micromechanical systems can be built using multi-layer MEMS processes. There is however a tradeoff available between process complexity and post-fabrication complexity (assembly operations). In this project, we fabricate sockets, connectors and the tools to pick up and rotate them using a single mask Silicon-on-Insulator (SOI) process. We then use pick and place assembly to create complex mechanical micro-systems which are difficult to realize with conventional fabrication techniques.

Project end date: 08/31/05

RTH40: Effects of Boron Concentration on Si1-xGex Properties for Integrated MEMS Technology

Marie-Ange Eyoum
2005

Because of its low thermal budget that allows to fabricate MEMS micromachined structures directly on top of electronics, SiGe MEMS technology remains very attracting for the monolithic integration of MEMS with CMOS [1]-[3]. In this scheme, p+Ge would replace Silicon dioxide as the sacrificial layer while p+ SiGe would replace poly Silicon as the structural layer.

Project end date: 09/01/05

BPN331: Plastically Self-Alligned Micromirrors

TeHsi Lee
2006

This project aims to use the plastic deformation of silicon as the key process to make Angular Vertical Comb-drive (AVC) actuators using a simple 3-mask process and yet providing versatility for the various applications.

Project end date: 02/14/06

RM8: Stiction in MEMS

Brian Bush
2005

Electrostatic forces, due to trapped charge or applied voltage, can lead to unwanted adhesion in MEMS devices. We wish to use various techniques, including Electronic Force Microscopy (EFM) and Cantilever Beam Arrays (CBA), to characterize the effect of surface modifications on the electrical properties of MEMS components and to better understand the forces that cause stiction. This knowledge will enable one to develop novel surface modifications or self-assembling monolayers that are specifically designed to combat stiction due to electronic forces.

Project end date:...

KSJP33: Silicon on Insulator Microassembly

Subramaniam Venkatraman
2006

To develop actuated 2-axis micromirrors and walking microrobots using a pick-and-place assembly process. Simple fabrication processes have a high fabrication yield and quicker design cycles than complex processes. The quest to minimize process complexity has led us to a single-mask Deep Reactive Ion Etch (DRIE) using Silicon on Insulator (SOI) wafers. After release, these parts are broken free from the device layer of the SOI wafer using grippers fabricated in the same single-mask process, rotated 90 degrees out-of-plane, and then assembled with other parts (figure 1). With this...

BPN309: SAM for MEMS Packaging/Fuel Cell Applications

SangHoon LEE
2006

In this project, Self-Assembled Monolayer (SAM) is investigated for possible MEMS packaging and fuel cell applications.

Project end date: 07/31/06

BPN318: SiGe Processing for the Fabrication of a Floating Electromechanical System (FLEMS) Gyroscope

Marie-Ange Eyoum
David Garmire
2006

The long term range of this project was to demonstrate fabrication and control of a potential integrated FLEMS (Floating Electromechanical) Gyro using SiGe MEMS Technology. The sensor system is comprised of a disk-shaped proof mass that is to be electrostatically suspended between sense and drive electrodes located above, below, and at the sides of the disk. An attractive feature of this design is that the proof mass is not structurally linked via suspension, so that mechanical losses associated with anchors are eliminated

Project end date: 08/02/06