Abstract:
Complex three dimensional micromechanical systems can be built using multi-layer MEMS processes. There is however a tradeoff available between process complexity and post-fabrication complexity (assembly operations). In this project, we fabricate sockets, connectors and the tools to pick up and rotate them using a single mask Silicon-on-Insulator (SOI) process. We then use pick and place assembly to create complex mechanical micro-systems which are difficult to realize with conventional fabrication techniques.
Project end date: 08/31/05
Publication date:
August 30, 2005
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2005