RM8: Stiction in MEMS


Electrostatic forces, due to trapped charge or applied voltage, can lead to unwanted adhesion in MEMS devices. We wish to use various techniques, including Electronic Force Microscopy (EFM) and Cantilever Beam Arrays (CBA), to characterize the effect of surface modifications on the electrical properties of MEMS components and to better understand the forces that cause stiction. This knowledge will enable one to develop novel surface modifications or self-assembling monolayers that are specifically designed to combat stiction due to electronic forces.

Project end date: 06/28/06

Brian Bush
Publication date: 
February 1, 2005
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2005

*Only registered BSAC Industrial Members may view project materials & publications. Click here to request member-only access.