Abstract:
An approach to fluidic interconnection which integrates a mesoscopic needle with a fluidic micro-device and which uses a membrane as a connector has been developed. This concept has been realized by the use of fusion bonding to create embedded devices within the needle and deep reactive ion etching (DRIE) to bulk etch the needle shape. Using this technique, interconnection alignment issues are reduced and the connection can be temporary or permanent. Piercing tests of gel and latex membranes were performed with the fabricated mesoscopic needles. Fluid was seen flowing through the interconnect to the test device.
Publication date:
May 31, 1999
Publication type:
Master's Thesis
Citation:
Scalf, J. A. (1999). Integrated Mesoscopic Fluidic Interconnects for Micro-machined Fluidic Devices. United States: University of California, Berkeley.