Research that includes:
- Low temperature MEMS-on-CMOS Silicon-Germanium process for adding MEMS to finished CMOS wafers or dice
- Silicon Carbide process for adverse environment MEMS and high frequency RF resonators
- Localized bonding: eutectic, fusion, solder, laser, inductive, rapid thermal processing, and ultrasonic; suitable for device level or wafer level packaging or sealing applications to plastic, glass, silicon and Bio materials, including liquid encapsulation
- Fluidic microassembly for post-process combining of dissimilarly processed microdevices
- Carbon nanotube and silicon nanowire directional growth in post-process, low ambient temperature environments
- Stiction mitigation for MEMS
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