LWL14: Selective Induction Heating for MEMS Packaging


Develop a wafer bonding and hermetic sealing technology based on induction heating for MEMS and IC post packaging.

Project end date: 08/19/04

Publication date: 
August 18, 2004
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2004

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