Package, Process & Microassembly

Research that includes:

  • Low temperature MEMS-on-CMOS Silicon-Germanium process for adding MEMS to finished CMOS wafers or dice
  • Silicon Carbide process for adverse environment MEMS and high frequency RF resonators
  • Localized bonding: eutectic, fusion, solder, laser, inductive, rapid thermal processing, and ultrasonic; suitable for device level or wafer level packaging or sealing applications to plastic, glass, silicon and Bio materials, including liquid encapsulation
  • Fluidic microassembly for post-process combining of dissimilarly processed microdevices
  • Carbon nanotube and silicon nanowire directional growth in post-process, low ambient temperature environments
  • Stiction mitigation for MEMS

JSS1/RTH: Fluidic assembly of RF receiver with glass-substrate inductors & antenna

Jack Peng
2003

The goal of this project is to use fluidic self-assembly to integrate RF CMOS chiplets onto micro-machined wells in glass. Because an insulator(glass) is used as the substrate, a high Q-factor of the inductor is expected. Another advantage is the low parasitic interconnects associated with the fluidic self-assembly process.

Project end date: 08/22/03

RMW26: Fabrication of a High Aspect Ratio Piezoelectric Microactuator

Jonathan D. Foster
2003

We are developing a new type of piezoelectric microactuator (and microsensor). Modeling indicates that this microactuator should be able to provide displacements and forces similar to or better than electrostatic actuators, but at lower voltages. In use as a microsensor, high sensitivities (in terms of Volts per microNewton) are expected from this device. Unlike typical piezoelectric microactuators or microsensors, displacement of this microactuator/microsensor is directed in the plane of the substrate, which permits more sophisticated devices to be developed. Current development...

LWL19: Nickel Nanocomposite Film for MEMS Applications

Kwok-Siong Teh
2003

The ultimate goal is to develop CMOS-compatible, low cost nickel-nanocomposite materials to complement polysilicon for use as MEMS structural material.

Project end date: 01/24/04

BSAC2: Reversible Bonding Process Development

Ning Chen
Mathew Wasilik
2003

Reversible bonding process is often used in MEMS fabrication where one side of the wafer need to be protected against the subsequent process, or to protect part of the equipment from exposing to the environment in DRIE through wafer etch, and the application list goes on. It plays a low profile supporting role in many of the fabrication processes. Its importance is often over looked, however. A badly designed bonding process has devastating consequences. Better reversible bonding processes are needed. Several reversible bonding process have been developed to suite various processing...

RTH30: Micromachined Electrodes for Capacitive Sensors

Noel Arellano
2003

The goal of this project is to develop and batch fabricate a very precise electrode for a high performance capacitive sensor using microfabrication techniques.

Project end date: 02/06/04

RTH32: Fluidic Microassembly for Microfluidic Applications

Frank Zendejas
2003

The project encompasses the extension of capillary-based fluidic self-assembly [1] to the assembly of silicon microparts on polydimethylsiloxane (PDMS).

Project end date: 02/09/04

RTH31: Electrical Interconnect of Components Transferred by Fluidic Microassembly Using Capillary Forces

Karen L. Scott
2003

The overall objective of this project is to extend the understanding of the fluidic microassembly technique using capillary forces. Specifically, the focus has been to obtain single to multiple electrical interconnects between microcomponents and the substrate.

Project end date: 02/10/04

RM6: Adhesion in MEMS

Robert Ashurst
Elizabeth E. Parker
2004

The ultimate goal of this project is to further develop previous work that involved adhesion studies in MEMS devices.

Project end date: 08/18/04

BSAC1: FTIR In Situ Depth Measurement System for DRIE

Matthew Wasilik
Ning Chen
2004

An in-situ, real-time metrology system was developed, integrated, and tested for measuring the depth of MEMS device structures during deep reactive ion etch (DRIE) processing in The UCB Microlab’s STS. The DRIE process is used to fabricate high-aspect-ratio silicon structures via a special switched-gas (Bosch process) plasma etch scheme. DRIE is promising technology in that it is capable of delivering MEMS devices at a relatively low cost. However, a major difficulty with this type of processing is the control of etch depth. Our research shows that it is possible to monitor the etch...

LWL14: Selective Induction Heating for MEMS Packaging

Andrew Cao
2004

Develop a wafer bonding and hermetic sealing technology based on induction heating for MEMS and IC post packaging.

Project end date: 08/19/04