Albert P. Pisano (Advisor)

BPN491: SiC TAPS: Ion Beam Deposited SiC for MEMS Encapsulation

David R. Myers
2010

This project seeks to create a harsh environment encapsulated strain sensor useful in high temperature and high shock environments.

Project end date: 08/11/10

BPN418: MEMS Poly/Nano: Polymer Coated Cantilevers for Infrared Heat Sensing

Clinton G. Warren
2010

A polymer-polysilicon cantilever bimorph device is to be utilized as a thermal infrared detector. Third generation prototypes were designed, fabricated, and are being tested. These device utilize a capacitive readout scheme, a double-beam design in order to eliminate the effect of residual stress in the polymer layer, and a nitride stopper layer for reduced sticking and pull-in. Devices are characterized using optical and thermal methods. Future goals include detailed characterization of the current prototypes, analytical model correlation, low-pressure testing, geometric...

BPN535: MEMS Poly/Nano: Nano-Particulate Composite Materials for Energy and Sensing Applications

Nuo Zhang
2010

The goal of this project is to develop a high-K, high breakdown, polymer nanocomposite material system. The novel material is composed of a high dielectric strength polymer seeded with core-shell nanoparticles. This technology will enable the development of low-cost, highly reliable, high energy density ultracapacitor system for energy storage. It is also a possible method to enhance the sensitivity of polymer based infrared sensor.

Project end date: 08/12/10

BPN364: MEMS Power: Flame Ionization

Ryan Xie
2010

Our long term goal is to develop and implement a micro flame ionization sensor that can be fabricated using existing techniques. These sensors can be fitted into any combustion engines to monitor combustion events and processes. An array of miniaturized sensors may also be used to detect the flame speed and propagation direction by time-of-flight analysis. These sensors, when used in combination to advanced engine tuning techniques, may increase combustion efficiency, or be used to reduce emissions.

Project end date: 02/02/11

BPN597: QES: Design and Optimization of Passive Wireless Implantable Pressure Sensors

Neel K. Shah
Mozziyar Etemadi
Rishi Kant
2011

Inductor design for passive wireless implantable use presents several challenges not currently addressed. A small form factor is desired for minimally invasive implantation and monitoring, and a low frequency is necessary for effective through-body power transfer. However a small inductor area limits effective power transfer and low-frequency operation. It is thus necessary to optimize the inductor for maximal power transfer while satisfying tight area and low frequency constraints. We present a design methodology for planar circular spiral inductors used with capacitive pressure...

BPN590: QES: MEMS Polymer Infrared Sensor Array

Nuo Zhang
2011

This project's goal is to design, fabricate and test a MEMS, polymer-based, un-cooled thermal infrared (IR) sensor array. The sensors will be based on polymer-ceramic bimorph (two-layer) beams. Absorption of the incident IR radiation by each bimorph cantilever beam raises its temperature, resulting in proportional deflection due to the mismatch in thermal expansion of the two bimorph materials.

Project end date: 08/16/11

BPN444: HEaTS: A MEMS Piezoelectric Supercritical Carbon-Dioxide Valve

Ya-Mei Chen
2011

The long range goal of this research is to design and fabricate a microscale valve suitable for controlling the flow of supercritical carbon-dioxide for application to advanced printing technology (supercritical carbon-dioxide valve, SCV). This valve is actuated by aluminum nitride (AlN) beam with piezoelectric effect. This valve will be integrated with nozzles and microchannels and the whole system will be built using silicon-based micro-electro-mechanical systems (MEMS).

Project end date: 08/18/11

BPN393: QES: µC-LHP Chip Cooling System - Evaporative Heat Transfer Wick and Fractal Transport Network

Christopher W. Hogue
2011

The ultimate goal of the microColumnated Loop Heat Pipe (mLHP) is to develop a highly-integratable isothermal "ground plane" (analogous to an electronic ground plane) to more efficiently transport heat away from high-power electronic devices. Metallic and even synthetic diamond substrates, which rely solely on solid conduction for thermal transport, are gradually proving themselves inadequate as heat spreaders for current and future electronic devices. Consequently, there is tremendous interest in cooling technologies that utilize phase change for the absorption and rejection of...

BPN481: HEaTS: Aluminum Nitride Technology for Inertial Sensors

Gabriele Vigevani
2011

The goal of this work is to design and fabricate inertial sensors based on c-axis oriented AlN polycrystalline thin films. AlN is a post-CMOS compatible piezoelectric material widely used for acoustic resonators, such Bulk Acoustic Wave (BAW) and Lamb Wave Resonators (LWR). In this work we develop the design techniques necessary to obtain inertial sensors with AlN thin film technology. Being able to use AlN as structural material for both acoustic wave resonator and sensing elements is key to achieve the three level integration of RF-MEMS components, sensing elements and CMOS in the...

BPN396: QES: microLHP Chip Cooling System - Columnated Wick and Device Design

Navdeep S. Dhillon
2011

The ultimate project goal for the microLHP Chip Cooling System is to design and fabricate a very high conductivity substrate, which can be interfaced directly with high heat flux chips to satisfy the enhanced cooling requirements of today's electronic devices. Phase change technology is the preferred choice, given its ability to absorb large heat fluxes through latent heat. Capillary driven systems such as Loop Heat Pipes (LHP) and thermosyphons are simple passive devices with no moving parts, and have proved extremely efficient and reliable. Nevertheless, the large size and geometry...