The ultimate project goal for the microLHP Chip Cooling System is to design and fabricate a very high conductivity substrate, which can be interfaced directly with high heat flux chips to satisfy the enhanced cooling requirements of today's electronic devices. Phase change technology is the preferred choice, given its ability to absorb large heat fluxes through latent heat. Capillary driven systems such as Loop Heat Pipes (LHP) and thermosyphons are simple passive devices with no moving parts, and have proved extremely efficient and reliable. Nevertheless, the large size and geometry of these macro-scale devices is ill-suited for interfacing with densely packed chips, and even though some companies have come out with miniaturized planar versions, a fully functional and feasible wafer level LHP for seamless chip integration is still a dream. The proposed microLHP will be a modular and scaleable device fabricated on the wafer, and it will employ novel MEMS micro-fabrication techniques and materials. A novel columnated wick design will prevent wick dryout, to enhance reliability and avoid device failure. The device will be optimally designed to transport high heat fluxes in high-g environments.
Project end date: 02/04/12