Package, Process & Microassembly

Research that includes:

  • Low temperature MEMS-on-CMOS Silicon-Germanium process for adding MEMS to finished CMOS wafers or dice
  • Silicon Carbide process for adverse environment MEMS and high frequency RF resonators
  • Localized bonding: eutectic, fusion, solder, laser, inductive, rapid thermal processing, and ultrasonic; suitable for device level or wafer level packaging or sealing applications to plastic, glass, silicon and Bio materials, including liquid encapsulation
  • Fluidic microassembly for post-process combining of dissimilarly processed microdevices
  • Carbon nanotube and silicon nanowire directional growth in post-process, low ambient temperature environments
  • Stiction mitigation for MEMS

BPN821: 3D Printed Smart Application with Embedded Electronics Sensors and Systems

Yuji Gao
2016

Our goal is the development of personalized applications using a 3D printed process which integrates liquid-state printed components and interconnects with readily available silicon IC chips layered across all three dimensions with various orientations to deliver fully integrated system-level functionalities. Our process allows for personalization of objects with electronic capabilities through the incorporation of advanced IC components and various sensing and actuation functionalities within complex 3D architectures. As an example application, our process can be used to develop...

BPN823: Automated System for Assembling a High-Density Microwire Neural Recording Array

Travis L. Massey
2016

Assembly at the microscale involves manipulation of one or more components relative to another in order to create a microstructure or device composed of these two or more components that would be difficult or impossible to monolithically fabricate. One specific class of problems that is well suited to microassembly rather than microfabrication is the creation of very high aspect ratio out-of-plane microstructures. As size and complexity of these out-of-plane microstructures grows, it becomes compelling if not necessary to automate the device assembly. To this end, we are developing...

BPN354: The Nanoshift Concept: Innovation through Design, Development, Prototyping, and Fabrication Services

Ning Chen
Salah Uddin
2019

Nanoshift LLC is a privately held development company specializing in MEMS, microfluidics, and nanotechnologies. Nanoshift provides high quality, customizable services for device and process design, research and development, rapid prototyping, low-volume fabrication, and technology transfer into high volume. Projects are typically from industry, government, and academia. Nanoshift collaborates with BSAC to make industry-leading development resources available for all BSAC Industrial Members, while improving BSAC's visibility and funding.

Project end date: 05/17/19

BPN410: Endeavor AT Aluminum Nitride Deposition Process Characterization

Matthew Wasilik
2010

A new cluster tool system, the Endeavor AT, was recently installed and characterized in the Marvell Nanolab. The system was donated by Analog Devices, and consists of three physical vapor deposition chambers for molybdenum sputtering, piezoelectric aluminum nitride sputtering, and aluminum sputtering respectively. The AlN process was thoroughly characterized with response surface design and factorial design of experiments. The AlN process has been released for general labmember use. The results of the process characterization are presented here.

Project end date: ...

BPN912: Optoelectronic Packaging and Multi-Chip Integration

Jean-Etienne Tremblay
2020

Heterogeneous integration of optical integrated components promises to bridge the gap in functionality of different material platforms currently in use. For example, high performance gain materials such as indium phosphide can now be integrated with reliable silicon photonic circuits to create sophisticated tunable light sources. We propose a multi-chip heterogeneous integration platform using edge coupling to couple light in-between chips and evanescent coupling to couple light to optical fibers. The proposed optoelectronic packaging scheme enables applications for low power, large...

BPN917: Low-Cost, Efficient, Photolithography-Free Fabrication of Stretchable Electronics Systems on a Vinyl Cutter

Renxiao Xu
Peisheng He
2020

We present a new way for the fabrication of stretchable electronics systems without photolithography procedures by exploiting the through-cut, tunnel-cut, and blind-cut modes of a commercial desktop-size vinyl cutter. Compared to previous studies involving photolithography, our method produces a batch of representative devices in significantly reduced time (by ~69%) and cost (by ~73%) with similar feature sizes (100-1000um). Our inclusion of blind-cut and tunnel- cut modes facilitates the fabrication of complex stretchable electronics systems, rather than only electrodes and...