Abstract:
Vacuum encapsulation of RF disk and beam resonators is necessary in order to maintain high Q and frequency stability. However, the difference in the coefficient of thermal expansion of the package material and the substrate lead to package induced stress. This project aims to explore the effects of this stress on the frequency response of the resonators using finite element analysis (FEA) software. Simulations performed on resonators packaged using conventional hermetic encapsulation techniques such as anodic and fusion bonding will be compared to that of an in situ packaging method where the resonators are housed in a polysilicon shell.
Project end date: 08/25/15
Publication date:
February 2, 2015
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2015