Package, Process & Microassembly

Research that includes:

  • Low temperature MEMS-on-CMOS Silicon-Germanium process for adding MEMS to finished CMOS wafers or dice
  • Silicon Carbide process for adverse environment MEMS and high frequency RF resonators
  • Localized bonding: eutectic, fusion, solder, laser, inductive, rapid thermal processing, and ultrasonic; suitable for device level or wafer level packaging or sealing applications to plastic, glass, silicon and Bio materials, including liquid encapsulation
  • Fluidic microassembly for post-process combining of dissimilarly processed microdevices
  • Carbon nanotube and silicon nanowire directional growth in post-process, low ambient temperature environments
  • Stiction mitigation for MEMS

BPNX1018: Free Surface Investigation in Large-Area Projection Micro Stereolithography (New Project)

David Hahn
2024

This project seeks to additively manufacture micro-architected cellular solids in high resolution, large area in hundreds of millimeters, containing millions of unit cells which are defect-free.

Project is currently funded by: Federal

BPNX1020: High-Throughput Multi-Material Vat Photopolymerization Using Dual Liquid Constrained Interfaces (New Project)

William Dong
2024

Multi-material additive manufacturing (MMAM) possesses immense potential to revolutionize product design by integrating intricate three-dimensional (3D) shapes and materials with distinct properties. Among the diverse AM processes, digital light processing (DLP)-based vat photopolymerization (VPP) distinguishes itself with high resolution and rapid fabrication speed across a spectrum of materials. However, MMAM with DLP encounters a critical bottleneck due to frequent printing process interruptions needed for material switching, significantly limiting overall efficiency. This...

BPN985: Multimaterial Nanoscale 3D Printing

Daniel Teal
2024

We propose a new multimaterial 3D printing technique with projected sub-micron resolution. Inorganic nanoparticles (≈1-10nm) of common microfabrication materials are electrically charged, manipulated electromagnetically in vacuum with an ion trap, and shot toward a substrate where they deposit onto a part under construction, similar to PVD methods. To date, we have demonstrated some basic material deposition and are beginning implementation of high-resolution printing. Eventually, this ion printing technology could allow rapid prototyping of integrated circuits and MEMS....

BPN969: Joule Bonding: Localized Solder Bonding for Heterogenous Integration of MEMS

Daniel Teal
2022

We are developing a new MEMS bonding process in which we use extremely carefully controlled resistive heating to make a solder bond with negligible substrate temperature rise and tighter temperature control than in laser bonding; we do this by using the temperature change of the heater resistivity as a temperature sensor for closed-loop control. Previously, we analyzed transient heat flow and showed initial progress toward heater control. Now, we have completed our theoretical analysis with a description of temperature fluctuations due to local inhomogeneities on the chip and how to...

BPN826: Autonomous Flying Microrobots

Nathan Lambert
2022

Among the state of the art academic research on pico air vehicles, the majority has focused on biomimetic flight mechanisms (e.g. flapping wings). This project looks to develop new microfabricated transduction mechanisms and systems for flying microrobots with the goal of opening up the application space beyond that allowed by the industry-standard single quadcoptor. One proposed mechanism, electrohydrodynamic (EHD) force generated via sub-millimeter corona discharge, functions silently and with no moving parts, directly converting ion current to induced airflow. Current work is...

APP38: Microconnector

Helen Holder
2003

Design and fabricate a mechanical interconnect system for use in MEMS and miniaturized applications enabling modular construction of complex 3D structures, and generic enough to be compatible with most designs without modifying original devices.

Project end date: 07/30/03

JSS1/RTH: Fluidic assembly of RF receiver with glass-substrate inductors & antenna

Jack Peng
2003

The goal of this project is to use fluidic self-assembly to integrate RF CMOS chiplets onto micro-machined wells in glass. Because an insulator(glass) is used as the substrate, a high Q-factor of the inductor is expected. Another advantage is the low parasitic interconnects associated with the fluidic self-assembly process.

Project end date: 08/22/03

RMW26: Fabrication of a High Aspect Ratio Piezoelectric Microactuator

Jonathan D. Foster
2003

We are developing a new type of piezoelectric microactuator (and microsensor). Modeling indicates that this microactuator should be able to provide displacements and forces similar to or better than electrostatic actuators, but at lower voltages. In use as a microsensor, high sensitivities (in terms of Volts per microNewton) are expected from this device. Unlike typical piezoelectric microactuators or microsensors, displacement of this microactuator/microsensor is directed in the plane of the substrate, which permits more sophisticated devices to be developed. Current development...

LWL19: Nickel Nanocomposite Film for MEMS Applications

Kwok-Siong Teh
2003

The ultimate goal is to develop CMOS-compatible, low cost nickel-nanocomposite materials to complement polysilicon for use as MEMS structural material.

Project end date: 01/24/04

BSAC2: Reversible Bonding Process Development

Ning Chen
Mathew Wasilik
2003

Reversible bonding process is often used in MEMS fabrication where one side of the wafer need to be protected against the subsequent process, or to protect part of the equipment from exposing to the environment in DRIE through wafer etch, and the application list goes on. It plays a low profile supporting role in many of the fabrication processes. Its importance is often over looked, however. A badly designed bonding process has devastating consequences. Better reversible bonding processes are needed. Several reversible bonding process have been developed to suite various processing...