Abstract:
Design and fabricate a mechanical interconnect system for use in MEMS and miniaturized applications enabling modular construction of complex 3D structures, and generic enough to be compatible with most designs without modifying original devices.
Project end date: 07/30/03
Publication date:
February 10, 2003
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2003