Liwei Lin (Advisor)

Research Advised by Professor Liwei Lin

Lin Group:  List of Projects | List of Researchers

LWL18: Integration of NEMS and MEMS by Localized Growth of Nanowires

Ongi Englander
2005

Integrated manufacturing of nano-to-micro systems is critical for the practical applications of nanotechnology. This research project aims (1) to develop and characterize an integrated manufacturing process to connect nanostructures with micro scale systems and (2) to utilize the integrated structure for practical sensing applications.

Project end date: 08/31/05

BPN331: Plastically Self-Alligned Micromirrors

TeHsi Lee
2006

This project aims to use the plastic deformation of silicon as the key process to make Angular Vertical Comb-drive (AVC) actuators using a simple 3-mask process and yet providing versatility for the various applications.

Project end date: 02/14/06

BPN309: SAM for MEMS Packaging/Fuel Cell Applications

SangHoon LEE
2006

In this project, Self-Assembled Monolayer (SAM) is investigated for possible MEMS packaging and fuel cell applications.

Project end date: 07/31/06

LWL16: On-Chip DNA Transformation by Local Heat Shock and Cell Cryopreservation

Sha Li
2007

To develop DNA transformation by local heat shock and on-chip cryopreservation of cells with MEMS technology.

Project end date: 02/02/07

BPN341: Plastic Energy Harvester

YiinKuen Fuh
2006

This project aims to develop a plastic energy harvesting system by utilizing piezoelectric ceramics to scavenge energy from natural motions for self-powered sensor applications. Plastic molding processes will be employed to achieve a low cost and high reliability/repeatability manufacturing process. Several piezoelectric configurations such as uni-morphs(THUNDER?), bimorphs as well as multilayers will be explored with particular focus on power maximization and highly-reliable structures in order to survive harsh environment. The ultimate goal will be the development of low-cost,...

BPN353: Integration of MEMS switches and RF passive components

Tommy Fujii
Dan McCormick
2006

In order to develop advanced multi-functional RF devices for future applications, it is expected that significant advancements must be made to existing technologies or a new technology must be developed. One such enabling technology is the ability to integrate all passive elements and switches monolithically. This technology would represent a new class of RF design and manufacturing capabilities. In order to develop this technology and make it a reality, we are investigating the feasibility of a fabrication process integrating high quality MEMS switches, spiral inductors and MIS...

LWL24: Rapid Bonding of MEMS Strain Gauge to Steel

Brian D. Sosnowchik
Ko-Min Liao
2007

A rapid and reliable bonding method is needed to bond MEMS strain gauges to steel. The MEMS strain gauge is to be bonded to the manufactured steel after all other steel treatment steps have been completed; hence the bonding method must be kept at low temperature to prevent any thermal damage to the steel composition. In addition, the bonding method must not introduce high residual strains, which would cause error in strain gauge measurements. The strain gauge to steel bond must also have the ability to survive several years in a wide working temperature range (-60oC to 150oC) in an...

MCW8: MEMS Endoscopic Lens-Based Optical Coherence Tomography

Ki-Hun Jeong
Jingyi Chen
Jongbaeg Kim
2006

There is a need to develop a compact in dimension, high speed, bi-axial scanning, and robust scanner with Microelectromechanical Systems (MEMS) technology for in vivo imaging in Optical Coherence Tomography (OCT) applications. These MEMS based endoscoopes with distal beam scanning can image with higher speed, precision, and repeatability than conventional linear scanning endoscopes in which the entire endoscope is mechanically translated with respect to the observed tissue. Most importantly, with bi-axial scanning capability of the MEMS scanner, three dimensional in vivo real time...

LWL26: Nano Photodetectors

Lei Luo
2007

Development of UV sensors using nanowires of wide-gap materials for applications in nano-optics and chemical-detection.

Project end date: 01/29/08

BPN307: CMOS Integrated Nanowires/Nanotubes (CMOS-Inn)

Yingqi Jiang
2008

The goal of this project is to develop technologies for hierarchical assembly of nano structures (silicon nanowires (SNWs) and carbon nanotubes (CNTs)) with built-in CMOS interface circuits by utilizing localized and selective IC-compatible synthesis, for a fully integrated nano-sensing system. Ultimately, both the nano-sensor element and the signal processing circuits should be fabricated on the same device substrate. The SNWs/CNTs will be synthesized afterwards locally and selectively using MEMS resistive heaters. In order to develop the integration process, we plan to use the 0.35...