BPN353: Integration of MEMS switches and RF passive components


In order to develop advanced multi-functional RF devices for future applications, it is expected that significant advancements must be made to existing technologies or a new technology must be developed. One such enabling technology is the ability to integrate all passive elements and switches monolithically. This technology would represent a new class of RF design and manufacturing capabilities. In order to develop this technology and make it a reality, we are investigating the feasibility of a fabrication process integrating high quality MEMS switches, spiral inductors and MIS capacitors. Electrical and mechanical designs have been completed and prototype fabrication is currently in process.

Project end date: 02/02/07

Tommy Fujii
Dan McCormick
Publication date: 
August 22, 2006
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2006

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