"This project aims to develop a 130 nm mixed-signal CMOS system-on-chip (SoC) Test Vehicle that can subsequently be combined with thin-film piezoelectric materials to create an integrated, single-chip wireless IoT platform. The SoC, which includes a RISC-V microprocessor, a Bluetooth Low-Energy radio, and sensor interface electronics, is designed for minimal power consumption and wide operating voltage range. In addition to these core functions, the CMOS Test Vehicle will feature specialized interface circuits - including a sustaining amplifier for piezoelectric timing oscillators, a programmable-gain analog front end for sensor readout, and power-conversion circuitry - to support various piezo-based MEMS devices. Once the baseline CMOS fabrication is complete, our collaborators will deposit a piezoelectric film such as aluminum nitride (AlN) or scandium-doped AlN (ScAlN) atop the CMOS die. This postprocessing step is intended to enable fully integrated timing references, power converters, and various piezoelectric sensing elements on a single die.
By providing a pre-fabricated SoC designed to support thin-film piezoelectric devices, this Test Vehicle will streamline further research into monolithic sensor integration, CMOS-MEMS RF filters, and efficient energy harvesting. Additionally, the project incorporates educational components that emphasize semiconductor workforce development through hands-on training in IC design, process integration, and device characterization."
Project is currently funded by: Federal