BPN863: In Situ Gold Plating of Microfluidic Devices


Microfluidic devices are currently limited in their application potential by the lack of appropriate sensors or integrated electrodes. Building on the work of Prof. Dorian Liepmann's lab in electrodeposited electrodes and hot embossing, where deposited electrodes in contact with fluid channels are composed primarily of nickel, we endeavor to develop a novel process for gold-electroplating those nickel surfaces, within the channel, after the chip has been constructed (in situ). By using this process the metallic surfaces in contact with the electrolyte in the channel can be chemically passivated with a thin gold layer, thus limiting the participation of the device's materials in its operation. This process may also have the added benefit of sealing the nickel-plastic edges where bonding is sub optimal and leaking can occur. This process will contribute to further advances in both the mass- production and prototyping of plastic-based BioMEMS.

Project end date: 01/29/18

Publication date: 
August 16, 2017
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2017

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