This research project seeks to integrate an insulative dielectrophoretic (iDEP) pre-concentrator along with an ultrasonic bacterial endospore lyser into a single Zeonor substrate. This project is unique in that it combines aluminum nitride (AlN) ultrasonic transducers (developed at UC Berkeley) for endospore lysis with insulative dielectrophoretic concentrators (iDEP – developed at Sandia National Laboratories) for the first time on a common Zeonor substrate. The ultrasonic resonator will be mechanically packaged by the Zeonor substrate and will have the appropriate fluidic and electrical interconnect. In addition to the packaging, the Zeonor substrate will also have micro-flow passages for the transport of reagents, samples, and lysate patterned onto the top surface. Solvent assisted thermal diffusion bonding, developed at Sandia, will be will be used to create a sealed microfluidic system by bonding a “cover wafer” over the integrated and patterned Zeonor substrate.
Project end date: 01/07/06