Abstract:
A rapid bonding process for installing vacuum sealed MEMS strain sensor modules to mechanical components is being developed. This innovative process will be developed to replace conventional adhesive-based approaches. In particular, the silicon to steel bond must achieve these stringent requirements: long life, resistance to chemicals, short bonding process time, and a wide range of storage temperatures. To ensure that the strain within a steel substrate will be accurately measured by the MEMS strain gauge, properties of the bond layer between silicon and steel are observed and determined.
Project end date: 07/30/03
Publication date:
February 10, 2003
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2003