We aim to develop a family of autonomous silicon-based robotic insects that integrate actuation, computation, and power within a single platform. A silicon-on-insulator (SOI) device serves as the foundation, enabling electrostatic actuators that drive silicon linkages fabricated directly in the device layer. Electrostatic actuation provides a key advantage at the microscale, offering low power consumption suitable for energy harvesting and autonomous operation. Computation and communication are enabled by the Single Chip Micro Mote (SCuM, BPN803), while a Zappy2 chip with integrated solar cell arrays and a high-voltage level shifter supplies power to both actuators and electronics.
To advance this architecture, we introduce a fabrication process that integrates two SOI device layers through thermocompression bonding. This approach improves actuator force-to-weight ratio, enables assembly-free out-of-plane motion, and provides dual MEMS device layers for traditional spring–mass systems. The current design incorporates bi-layer SOI hinges for self-assembled out-of-plane actuators. Furthermore, we demonstrate multilayer electrical interconnects using an SOI-PCB concept, supporting heterogeneous CMOS integration, ultra-thin gap-closing actuators, and hinge-based out-of-plane mechanisms fabricated through the presented new substrate-released SOI process.
Project currently supported by: Member Fees