Wireless, RF & Smart Dust

Research that includes:

  • Tuneable RF components: capacitors, inductors, transformers
  • RF microrelays
  • High frequency MEMS resonators: devices, structures, and processes

BPN865: CMOS-Assisted Resoswitch Receivers

Kyle K. Tanghe

This project aims to harness extremely low power CMOS integrated circuits to boost the Q’s of micromechanical resoswitches towards much higher sensitivity resoswitch receivers.

Project end date: 08/12/19

BPN943: Silicon Carbide Thin Films for Chronically Implanted Microelectronics

Konlin Shen

Chronically implanted integrated circuits (ICs) can enable sophistication in implants beyond purely measurement, such as closed-loop modulation of physiology. However, the body is a corrosive and chemically aggressive environment in which ionic and reactive oxidative species can easily damage implanted microelectronics. Conventionally, implanted ICs are packaged in titanium or ceramic housing to reach decadal lifetime, but such packaging is not conducive to sub-millimeter scale miniaturization. Thin-film encapsulants such as parylene, SiO2, and SiC can greatly...

BPN916: Mesh-Networked Micro-Air-Vehicle Systems

Brian G. Kilberg

The goal of this project is to develop mesh-networked multi-agent robotic systems that can improve connectivity in network-adverse conditions. Mesh-networking enables longer communication range for multi- MAV systems with limited radio power and provides scalable peer-to-peer communications. This system is based on OpenWSN, which is an open-source implementation of the 6TiSCH networking protocol, whose underlying technology has been successful in mesh networks for industrial process automation. These successful mesh- networking technologies were originally intended...

BPN903: Applications of Wireless Sensor Networks

Brian Kilberg
Craig B. Schindler
Felipe Campos

As the size, cost, power, and communication latency of wireless sensor nodes continues to decrease, wireless sensor networks have the potential to be used in a variety of new and interesting ways. In this project we aim to demonstrate applications and use cases that are possible with small, low power, and low latency networks; for example, collecting high-resolution personal telemetry via products with embedded sensor networks, networked autonomous robotic systems, smart buildings, and industrial process control. While this project utilizes custom 15mmx15mm wireless sensor...

BPN560: Video Over Wireless Sensor Networks: From Camera to Smartphone

Fabien Chraim
Thomas Watteyne

To this date, Wireless Sensor Networks are still largely characterized by non-intensive applications, which means that they are mainly used to gather relatively small amounts of data. This project aims at pushing the limits of Sensor Networks to the point of transmitting video in real-time. The crucial advancement that enabled this application was the introduction of Time-Synchronized Channel Hopping which made communication more robust on unreliable wireless links. In addition to using the camera as a sensor, this project is concerned with interfacing smartphones with low power...

BPN844: Wireless Sub-Millimeter Temperature Sensor for Continuous Temperature Monitoring in Tissue

B. Arda Ozilgen

We demonstrate a tetherless, sub-millimeter implantable temperature sensing system employing ultrasonic powering and ultrasonic backscatter modulation assembled using commercially available components. We have demonstrated two sizes of sensors based on available components with volumes of 1.45 mm3 and 0.118 mm3. Individual sensors are able to resolve ±0.5 °C changes in temperature, suitable for medical diagnostic and monitoring purposes. Our goal is to solve a long-standing issue: chronically and tetherlessly monitoring deep tissue temperature.

Project ended: 12/18/...

BPN858: Zero Insertion Force MEMS Socket for Microrobotics Assembly

Hani Gomez

To help resolve the control and power challenges present in developing microrobots, the research focus of this project is the design and development of a zero insertion force (ZIF) MEMS socket. The ultimate goal is to achieve an electrical connection between a 65nm single-chip mote, a solar cell chip, and a multi-legged silicon-on-insulator (SOI) microrobot. As proof-of-concept, the most recent socket prototype has demonstrated a successful connection to a MEMS robotic leg chiplet, which is orthogonal to the socket. Both chiplets were fabricated using a two-mask SOI process. The...