NanoPlasmonics, Microphotonics & Imaging

Research that includes:

  • Polymer, printed optical lenslet arrays
  • Microfluidic tuneable photopolymer lenses
  • Optical switches and planar lightwave MEMS
  • Vertically integrated microconfocal arrays
  • Bio-inspired integration of tuneable polymer optics with imaging electronics

BPN390: Fluid microlens for MEMS

George Chao-chih Hsu

Tunable micro-lenses have been the focus of many studies recently. However, due to the inert complexity of the fluid-solid interaction, arraying has yet to be achieved. This project focuses on creating an efficient fabrication process with new design and materials. These improvements make the new design readily applicable to collimators and Shack-Harmon Sensors. Furthermore, we will study performance of various lens liquids, more specifically ones that will increase the working temperature range. We will then characterize the new lens liquids and hydrophobic layer under various...

BPN376: High frequency optoelectronic oscillator (OEO) by optical injection locking

Hyuk-Kee Sung
Erwin K. Lau

Optoelectronic oscillators (OEOs) can generate high-purity RF signals with very low phase noise. The application covers a wide area of photonic and RF systems such as microwave frequency standards, radars, RF photonics and optical signal processing. Conventional OEOs have two potential drawbacks: RF amplifiers with high gain (up to ~ 60 dB) are needed to compensate the RF link loss of the feedback loop; and high frequency operation is challenging. To overcome the drawbacks and further enhance the performance of OEO, we propose a novel optical injection-locked optoelectronic...

BPN349: MEMS Tunable Micro-optical Resonator

Ming-Chun (Jason) Tien

Microring and microdisk resonators are key components to realize silicon monolithic optoelectronic devices because they have the potential of integration with current CMOS electronic devices. The applications include most wavelength-division-multiplexing photonic circuits, such as optoelectronic transceivers, wavelength filters, add-drop multiplexers, optical delay lines, and group velocity dispersion compensators. Furthermore, in order to achieve dynamic switching functions, tunable capability is desired. Here we propose a tunable microring resonator with integrated MEMS actuators,...

DAH2: A MEMS Optical Modulator and Filter

Jack L. Skinner

Optical sensors have applications in chemical detection, thermal imaging, motion sensing, and temperature measurement. A narrow-band optical filter is often used to confine radiation intensity measurement to a specific range of optical wavelengths. Similarly, devices such as optical displays require precise filtration and modulation of light. The current project seeks to create a microelectromechanical system (MEMS) device with narrow-band optical filtering and modulation properties. This research will result in technology to decrease sensor size and improve sensor functionality,...

LWL26: Nano Photodetectors

Lei Luo

Development of UV sensors using nanowires of wide-gap materials for applications in nano-optics and chemical-detection.

Project end date: 01/29/08

BPN332: Monolithic micromirror array for single-chip MEMS-based dense wavelength division multiplexed (DWDM) crossconnect

Chenlu Hou

The new goal of this project is to develop a micromirror array, which can be integrated into monolithic 1xN wavelength-selective switch (WSS) and NxN wavelength-selective cross connect (WSXC) for dense wavelength division multiplexed (DWDM) network. The 0.8nm channel spacing of DWDM network requires a forty- element micromirror array with a pitch of 75�m for independent spatial switching of incoming wavelength channels among output waveguides. For integration into a 1x4 WSS and 4x4 WSXC, the micromirror requires a maximum mechanical scan angle of 9.2�.

Project end...

BPN308: Plastically Self-Aligned Micromirrors

SangHoon Lee
Chieh Chang

This project aims to use the plastic deformation of single-crystal-silicon as the key process to make Angular Vertical Comb-drive (AVC) torsional microactuators using a simple three-mask process on silicon-on-insulator wafer and yet providing versatility for the potential applications in Optical MEMS (switches, bi-directional free-space laser communications), RF MEMS (variable capacitor), Image/display (head mount display) and the others.

Project end date: 07/30/08

BPN337: Fast, MEMS-Based Phase-Shifting Interferometer

Hyuck Choo
Rishi Kant
David Garmire

We are developing a handheld bio-chemical sensor using the fast, MEMS-based, phase-shifting interferometer (MBPSI) that we have demonstrated at the Berkeley Sensor & Actuator Center.

Project end date: 08/12/08

BPN429: Plasmonic Nanocrescent Array for Ultrasensitive Biomoleculer Detection

Liz Y. Wu
SoonGweon Hong

Previously, we developed novel gold nanophotonic crescent moon structures with a sub-10 nm sharp edge, which can enhance local electromagnetic field at the edge area. In this project, we present a uniform array of the gold nanocrescents to generate stronger local electromagnetic field by summing up the effects of inter-particle and intra-particle electromagnetic field coupling. Stronger surface enhancement Raman scattering (SERS) signal is expected from the nanocrescent array due to the high density of the “hot spots”. The long-term goal of this project is to apply this uniform...

BPN423: Heterogeneous integration of microdisk laser on a silicon platform using lateral-field OET assembly

Ming-Chun (Jason) Tien
Kyoungsik Yu

Semiconductor lasers on a silicon platform have attracted much attention due to the potential of integration with CMOS integrated circuits. Silicon Raman lasers have been demonstrated, however, they still require external optical pumps. Heteroepitaxy can grow compound semiconductor lasers directly on Si, but the growth temperature (> 400oC) is usually too high for post CMOS processing. To circumvent this issue, electrically-pumped compound-silicon hybrid lasers have been integrated on Si wafers utilizing oxygen plasma-assisted wafer bonding or DVS-BCB-assisted bonding techniques....