Liwei Lin (Advisor)

Research Advised by Professor Liwei Lin

Lin Group:  List of Projects | List of Researchers

LWL26: Nano Photodetectors

Lei Luo
2007

Development of UV sensors using nanowires of wide-gap materials for applications in nano-optics and chemical-detection.

Project end date: 01/29/08

BPN307: CMOS Integrated Nanowires/Nanotubes (CMOS-Inn)

Yingqi Jiang
2008

The goal of this project is to develop technologies for hierarchical assembly of nano structures (silicon nanowires (SNWs) and carbon nanotubes (CNTs)) with built-in CMOS interface circuits by utilizing localized and selective IC-compatible synthesis, for a fully integrated nano-sensing system. Ultimately, both the nano-sensor element and the signal processing circuits should be fabricated on the same device substrate. The SNWs/CNTs will be synthesized afterwards locally and selectively using MEMS resistive heaters. In order to develop the integration process, we plan to use the 0.35...

BPN426: Flat Micro Heat Pipes for Cooling Applications

Armon Mahajerin
2008

The purpose of this project is to develop novel, flat (less than 1 mm thick) micro-machined heat pipe devices that may be implemented directly onto chips for cooling purposes. Using silicon to pattern and etch the microchannels for the heat pipe mechanism facilitates the integration of this technology by eliminating thermal mismatch between the chip and cooling device. The primary goal of using a heat pipe-based design versus the conventional heat sinks (usually fins) is to greatly improve the effective thermal conductivity of the cooling apparatus. This project currently is in the...

BPN308: Plastically Self-Aligned Micromirrors

SangHoon Lee
Chieh Chang
2008

This project aims to use the plastic deformation of single-crystal-silicon as the key process to make Angular Vertical Comb-drive (AVC) torsional microactuators using a simple three-mask process on silicon-on-insulator wafer and yet providing versatility for the potential applications in Optical MEMS (switches, bi-directional free-space laser communications), RF MEMS (variable capacitor), Image/display (head mount display) and the others.

Project end date: 07/30/08

BPN352: Micro/Nano Fluidic Interconnector

SangHoon Lee
2008

In this project, near-field electrospinning (NFES) is applied for site-specific, chip-to-chip micro/nano fluidic interconnectors. This fabrication/packaging technology enables off-chip fluidic transportations through fluidic channels of 50nm~5μm in diameter. Near-field electrospinning has the position controllability better than 10μm in contrast to the random deposition of conventional electrospinning.

Project end date: 09/03/08

BPN330: Non-magnetic Micro Heater

Jui-Ming (Ryan) Yang
2009

Non-magnetic heaters are desirable for systems sensitive magnetic fields, such as micromachined gyroscopes using spin-polarized nuclei. The short-term objective of this project is to design and fabricate MEMS resistive heaters that will generate minimum magnetic field while under resistive heating to provide the heating source for the micromachined gyroscope using spin-polarized nuclei. The long-term goal of the project is the integration of the non-magnetic heater with other components to accomplish micromachined gyroscope using spin-polarized nuclei within the magnetic shielding...

BPN329: Micro Magnetic Shielded Packaging

Armon Mahajerin
Woon-Kyung (Kevin) Choi
2008

The long-term goal of the project is to create the magnetic shielding packaging for a micro-machined gyroscope using spin-polarized nuclei. The shield is to have an attenuation above 10 to the 6 and a small size of approximately one cubic centimeter volume while allowing signal transmission lines to communicate with outside world. This is accomplished with multiple layers of high permeability material such as nickel-iron alloy. Current work focuses on new methods of fabricating shielding devices and the exploration of additional shielding materials.

Project end date:...

LWL25: Plastic 3-D W-band Antenna Array

Mike Fuh
2009

The goal of this project is to make low-cost, low power, and reconfigurable electromagnetic-wave beam-formers for potential W-band applications such as car collision avoidance radar, wireless local network (LAN), and radio links. The beam-forming is realized by phased antenna array. This research project responds to the need for complete system-level integration of RF or millimeter-wave (MMW) systems. We will develop technologies for 3-D structures by industrial plastic molding and electroplating processes with integrated active/passive components and reconfigurable beam-formers....

BPN382: 2D Individually-Addressable Nanowire Arrays

Peter C. Yang
2009

Semiconductor nanowires have recently stimulated great interest due to their attractive and potentially very useful properties, originating from features such as carrier confinement, high surface to volume ratio, and morphology/crystal structure unique to their nanoscale dimension and bottom-up growth process. These properties lead to many possible applications such as room temperature ballistic conductors for high-frequency/high-powered integrated circuits, UV/visible/IR nanolasers and waveguides, as well as sensors for chemical and biological agents. The systematic assembly and...

BPN361: MiNaSIP 2.C.1: MEMS Packaging Beyond Glass Frit

Jiyoung Chang
2009

Glass frit bonding is a largely popular method of encapsulating MEMS devices in the industry today. It's popularity is due to relatively low processing temperature, tunability of thermal coefficient of expansion, and hermetic sealing. However, glass frit bonding requires a large amount of space, sometimes as much as several times the size of the MEMS device itself. This attribute is largely responsible for limiting further scalability and miniaturization of individual dies. This research project aims (1) to take a deeper look into the shortcomings of the existing glass frit bonding...