Abstract:
In this project, near-field electrospinning (NFES) is applied for site-specific, chip-to-chip micro/nano fluidic interconnectors. This fabrication/packaging technology enables off-chip fluidic transportations through fluidic channels of 50nm~5μm in diameter. Near-field electrospinning has the position controllability better than 10μm in contrast to the random deposition of conventional electrospinning.
Project end date: 09/03/08
Publication date:
August 12, 2008
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2008