The development of 3D MEMS devices has enabled innovative sensor designs with enhanced functionality, yet conventional fabrication methods often impose geometric and process limitations. This work presents a micro-3D-printed tactile sensor, integrating 3D piezoelectric, capacitive, conductive and dielectric elements with a compliant mechanism to achieve high sensitivity and force decoupling capability. The sensor is fabricated using a multi-material digital light processing (DLP) method, followed by selective metallization to define conductive regions, enabling seamless electrical integration. We detail the design and optimization of the sensing element, focusing on its piezoelectric response and force decoupling performance. This approach provides a scalable pathway for high-performance, customizable tactile sensors, with potential applications in MEMS, robotics, and human-machine interfaces.
Project is currently funded by: Federal