Abstract:
In recent years we have seen a growing demand for 3D cameras for applications such as gaming, entertainment, and autonomous vehicles. Present solutions suffer from high power dissipation and large size. This project leverages heterogeneous integration of standard CMOS electronics with high performance optical components including lasers, photo-diodes, interferometers and waveguides to reduce size, cost, and power dissipation.
Project end date: 08/25/16
Publication date:
May 20, 2016
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2016