BPN366: SiC TAPS: Pressure Sensor Design and Optimization


The goal of this work is to deliver a sensor module with MEMS-based silicon carbide TAPS sensors integrated with SiC interface circuits for extreme harsh environment applications.

Project end date: 08/13/10

Benjamin Cheng
Publication date: 
August 11, 2010
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2010

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