Abstract:
The goal of the Harsh Environment and Telemetry Systems (HEaTS) program is to deliver a wireless sensor module with MEMS-based silicon carbide (SiC)sensors integrated with SiC interface circuits for extreme harsh environment applications.
Project end date: 08/13/12
Publication date:
January 30, 2012
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2012