APP83: MEMS Strain Gauge on Steel - Miniaturization of Transduction Circuits


The Research and Development proposed herein will improve the operating characteristics of traditional machine elements and the applications to which they contribute through the development and application of MEMS microstructures in two major categories. First, we will develop low-cost MEMS strain-sensing modules and the means to rapidly bond them to steel and other structures in large quantities. In addition to wire-based solutions, we will also develop modules for wireless data telemetry and power coupling to enable total systems-level solutions for the MEMS sensor modules. This will open the door toward providing low-cost load sensing for many applications. MEMS-based strain sensors offer much smaller gauge length (< 500 mm) than commercially available foil-type gauges.

Project end date: 07/24/07

Publication date: 
January 30, 2007
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2007

*Only registered BSAC Industrial Members may view project materials & publications. Click here to request member-only access.