Abstract:
In the course of eutectically bonding MEMS sensors to a substrate, residual thermal stresses can be induced in the sensor. These stresses have the potential to bias sensor signals, damage encapsulation and alter the operational range of the device. Using thermo- mechanical analyses, the goal of this work is to characterize the residual stresses and seek ways to ameliorate their effects on sensor packaging and operation.
Project end date: 08/14/07
Publication date:
February 22, 2007
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2007