APP56/OO: Thermally-induced residual stresses in MEMS sensors

Abstract: 

In the course of eutectically bonding MEMS sensors to a substrate, residual thermal stresses can be induced in the sensor. These stresses have the potential to bias sensor signals, damage encapsulation and alter the operational range of the device. Using thermo- mechanical analyses, the goal of this work is to characterize the residual stresses and seek ways to ameliorate their effects on sensor packaging and operation.

Project end date: 08/14/07

Author: 
Bayram Orazov
Publication date: 
February 22, 2007
Publication type: 
BSAC Project Materials (Final/Archive)
Citation: 
PREPUBLICATION DATA - ©University of California 2007

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