APP56/OO: Thermally-induced residual stresses in MEMS sensors


In the course of eutectically bonding MEMS sensors to a substrate, residual thermal stresses can be induced in the sensor. These stresses have the potential to bias sensor signals, damage encapsulation and alter the operational range of the device. Using thermo- mechanical analyses, the goal of this work is to characterize the residual stresses and seek ways to ameliorate their effects on sensor packaging and operation.

Project end date: 08/14/07

Bayram Orazov
Publication date: 
February 22, 2007
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2007

*Only registered BSAC Industrial Members may view project materials & publications. Click here to request member-only access.