APP55: MEMS Strain Gauge on Steel: Selective Strain Isolation


This project aims to design strain isolation trenches into the sensor package such that strain may be selectively isolated in specific sections, and along specific directions thereby reducing the cross-axis sensitivity of the strain sensor. The particular sensor package is an encapsulated, resonating MEMS strain gauge specially designed to be direct-mounted on steel with a strain resolution of 0.1u-strain. To this end, a strain isolation structure was designed that rejects cross-axis strain while still maintaining axial strain fidelity. A test structure is being fabricated to apply on chip strain to the structure and verify cross-axis rejection.

Project end date: 02/07/06

Publication date: 
August 30, 2005
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2005

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