This project aims to design strain isolation trenches into the sensor package such that strain may be selectively isolated in specific sections, and along specific directions thereby reducing the cross-axis sensitivity of the strain sensor. The particular sensor package is an encapsulated, resonating MEMS strain gauge specially designed to be direct-mounted on steel with a strain resolution of 0.1u-strain. To this end, a strain isolation structure was designed that rejects cross-axis strain while still maintaining axial strain fidelity. A test structure is being fabricated to apply on chip strain to the structure and verify cross-axis rejection.
Project end date: 02/07/06