LWL19: Nickel Nanocomposite Film for MEMS Applications

Abstract: 

The ultimate goal is to develop CMOS-compatible, low cost nickel-nanocomposite materials to complement polysilicon for use as MEMS structural material.

Project end date: 01/24/04

Author: 
Kwok-Siong Teh
Publication date: 
August 19, 2003
Publication type: 
BSAC Project Materials (Final/Archive)
Citation: 
PREPUBLICATION DATA - ©University of California 2003

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Tags

Package, Process & Microassembly topic page, Liwei Lin (Advisor) topic page