Abstract:
As an alternative material for surface micromachining, polycrystalline silicon-germanium (poly-SiGe) has comparable processes and material properties to polycrystalline silicon (poly-Si). Its low processing temperature is the major advantage of poly-SiGe as it enables post-CMOS integration of MEMS. This modular approach to MEMS integration is an attractive route to higher performance and lower cost microsystems.
Project end date: 01/24/07
Publication date:
August 23, 2006
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2006