Richard M. White (Advisor)

Low Temperature Silicon-Silicon Bonding with Oxides

Leslie A. Field

Richard S. Muller

1988

This report describes a novel low-temperature silicon-silicon bonding process using boron glass. Using this method, silicon wafers can be sealed together at 450C. The process is extremely sensitive to phosphorus. The integration of the boron-glass bonding process with MOS processing is discussed.

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Fluid-Actuated Micromachined Rotors and Gears

Leslie A. Field

Richard M. White

1991

Fluid-actuated micromechanical structure were designed and fabricated from polysilicon and silicon nitride using surface micromachining techniques. These structures included trains of micromechanical involute-toothed spur gears. The gear diameters ranged from 60 to 1600 um. To increase fluid drive force, rotors were coated with tensile films to induce residual sttresses to delibrately warp them and thereby increase the efficiency of fluid powering by giving them a higher profile. For stuffer strucutres such as gears that must remain planar in order to mesh, vane were added to increase the...

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Leslie A. Field

Alumni

Electrical Engineering and Computer Sciences

Professor Richard M. White (Advisor)

Ph.D. 1991

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BSAC Researchers Advised by Professor Richard M. White

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BSAC's Best: Fall 2009 Winners Announced

September 18, 2009

BSAC would like to thank the 150 researchers who presented their work in poster or plenary sessions at the Fall 2009 BSAC Research Review on September 16-18.

60 attending industrial members from 39 member organizations voted for the best presentations and posters, resulting in Best Paper and Best Poster awards (certificate and cash).

Best Paper...

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Gel-coated FPW Biosensors

Amy Wang

Richard M. White

1993

With the development of microsensors and microactuators, recent research efforts have been made towards utilizing these miniature instruments in biological applications. Flexural plate-wave (FPW) sensors are an example of such a micro-device. They belong to a family ...