Clark T.-C. Nguyen (Advisor)

Research Advised by Professor Clark T.-C. Nguyen

Nguyen Group:  List of Projects | List of Researchers

BPN814: UHF Capacitive-Gap Transduced Resonators With High Cx/Co

Kieran Peleaux
2021

The project explores methods by which the Cx/Co of UHF capacitive- gap transduced resonators might be increased to above 5% while maintaining Qs 10,000.

Parametric Oscillation with Wineglass Disk Resonators

Thanh-Phong Nguyen
Clark T.-C. Nguyen
Bernhard E. Boser
2018

Parametric oscillation provides another avenue to excite micro electro-mechanical resonators into oscillation. Rather than driving the resonator at its resonant frequency, modulating the stiffness of the resonator forces this motion. While this technique can lead to failures, it also can provide methods for frequency division, phase noise reduction, and sustaining oscillations of various frequency with a single amplifier. This work models the voltage conditions for parametric oscillation and compares them to measured results with an accuracy of 15%. Discrepancies caused by...

FEA-Assisted Analysis and Gain Optimization of a Micromechanical Resonant Displacement Amplifier

Gleb Melnikov
Clark T.-C. Nguyen
Kristofer S.J. Pister
2017

Micromechanical resonant switches have the potential to greatly outperform currently dominant semiconductor switches due to their higher figures of merit. Of the current designs available, resonant MEMS switches are among the most promising, as they can achieve very large amplitudes at resonance with greatly reduced actuation voltages compared to more conventional MEMS switches, such as those that rely on pull-in based actuation.

Such resonant micromechanical devices are currently in their infancy, and require additional optimization and analysis to resolve their...

Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability

Divya Kashyap
Clark T.-C. Nguyen
Liwei Lin
2015

Vacuum encapsulation of RF disk and beam resonators is often needed to maintain high quality factor and frequency stability. Conventionally, this is performed at the wafer level by anodic, eutectic, fusion, or glass frit bonding. After wafer dicing, packaging proceeds with die attach to the package substrate and plastic over molding. This process leads to many contacts between materials of different coefficients of thermal expansion (CTE) resulting in package-induced stress. The focus of this work is to determine the effect of this stress on the temperature stability of...

Gleb Melnikov

Alumni
Electrical Engineering and Computer Sciences
Professor Clark T.-C. Nguyen (Advisor)
M.S. 2017

Thanh-Phong Nguyen

Alumni
Electrical Engineering and Computer Sciences
Professor Clark T.-C. Nguyen (Advisor)
M.S. 2018

Divya Kashyap

Alumni
Electrical Engineering and Computer Sciences
Professor Clark T.-C. Nguyen (Advisor)
M.S. 2015

Yafei Li

Alumni
Electrical Engineering and Computer Sciences
Professor Clark T.-C. Nguyen (Advisor)
M.S. 2018

Ilya Gurin

Alumni
Electrical Engineering and Computer Sciences
Professor Clark T.-C. Nguyen (Advisor)
M.S. 2010

Tristan Rocheleau

Alumni
Professor Clark T.-C. Nguyen (Advisor)
PostDoc 2016