APP77: MEMS Strain Gauge on Steel: Elastic Encapsulation


The MEMS strain gauge on steel project aims to design a MEMS strain gauge that can be bonded directly to steel and accurately measure strain in small strain fields (gauge length of 1 mm or less). Encapsulation of the MEMS strain gauge, in contrast to microelectronics or inertial force sensor packaging, requires that the package be a mechanical transducer of the measurand to the sense elements. To meet the objective of hermetic, minimally-aliasing encapsulation of the strain gauge, we propose an elastic, wafer-level solution.

Project end date: 01/26/07

Robert G. Azevedo
Publication date: 
August 23, 2006
Publication type: 
BSAC Project Materials (Final/Archive)
PREPUBLICATION DATA - ©University of California 2006

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