BPNX1074: Packaging of Research MEMS for Practical System Evaluation (New Project)

Abstract: 

This project aims to develop flexible inert-environment packaging for nearly any resonant MEMS device to allow evaluation in practical real-world systems.

Project is currently funded by: Federal

Author: 
Shiwoo Lee
Neil Chen
Publication date: 
February 27, 2026
Publication type: 
BSAC Project Materials (Current)
Citation: 
PREPUBLICATION DATA - ©University of California 2026

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Tags

Current BSAC Research Project topic page, Package, Process & Microassembly topic page, Clark T.-C. Nguyen (Advisor) topic page