Wireless, RF & Smart Dust

Research that includes:

  • Tuneable RF components: capacitors, inductors, transformers
  • RF microrelays
  • High frequency MEMS resonators: devices, structures, and processes

BPN560: Video Over Wireless Sensor Networks: From Camera to Smartphone

Fabien Chraim
Thomas Watteyne
2010

To this date, Wireless Sensor Networks are still largely characterized by non-intensive applications, which means that they are mainly used to gather relatively small amounts of data. This project aims at pushing the limits of Sensor Networks to the point of transmitting video in real-time. The crucial advancement that enabled this application was the introduction of Time-Synchronized Channel Hopping which made communication more robust on unreliable wireless links. In addition to using the camera as a sensor, this project is concerned with interfacing smartphones with low power...

BPN844: Wireless Sub-Millimeter Temperature Sensor for Continuous Temperature Monitoring in Tissue

B. Arda Ozilgen
2020

We demonstrate a tetherless, sub-millimeter implantable temperature sensing system employing ultrasonic powering and ultrasonic backscatter modulation assembled using commercially available components. We have demonstrated two sizes of sensors based on available components with volumes of 1.45 mm3 and 0.118 mm3. Individual sensors are able to resolve ±0.5 °C changes in temperature, suitable for medical diagnostic and monitoring purposes. Our goal is to solve a long-standing issue: chronically and tetherlessly monitoring deep tissue temperature.

Project ended: 12/18/...

BPN858: Zero Insertion Force MEMS Socket for Microrobotics Assembly

Hani Gomez
2020

To help resolve the control and power challenges present in developing microrobots, the research focus of this project is the design and development of a zero insertion force (ZIF) MEMS socket. The ultimate goal is to achieve an electrical connection between a 65nm single-chip mote, a solar cell chip, and a multi-legged silicon-on-insulator (SOI) microrobot. As proof-of-concept, the most recent socket prototype has demonstrated a successful connection to a MEMS robotic leg chiplet, which is orthogonal to the socket. Both chiplets were fabricated using a two-mask SOI process. The...