Richard S. Muller (Advisor)

Micromachined Piezoelectric Microphones

Robert P. Ried
Richard S. Muller
1994
Performance limits of micromachined piezoelectric microphones are examined theoretically and experimentally. The various sources of microphone noise are combined to form a model for the signal-to-noise ratio, and this model is used to generate design rules...

Robert P. Ried

Alumni
Mechanical Engineering
Professor Albert P. Pisano (Advisor)
Ph.D. 1994

Carlos Mastrangelo

Alumni
Electrical Engineering and Computer Sciences
Professor Richard S. Muller (Advisor)
Ph.D. 1990

Thermal Applications of Microbridges

Carlos Mastrangelo
Richard S. Muller
1990
The thermal applications of electrically-heated polycrystalline-silicon microbridges are explored. An electrothermal model based on the balance of heat dissipation and heat losses is developed which determines the microbridge electrical characteristics. The...

Low Temperature Silicon-Silicon Bonding with Oxides

Leslie A. Field
Richard S. Muller
1988

This report describes a novel low-temperature silicon-silicon bonding process using boron glass. Using this method, silicon wafers can be sealed together at 450C. The process is extremely sensitive to phosphorus. The integration of the boron-glass bonding process with MOS processing is discussed.

Eun Sok Kim

Alumni
Electrical Engineering and Computer Sciences
Professor Richard S. Muller (Advisor)
Ph.D. 1990

Integrated Microphone with CMOS Circuits on a Single Chip

Eun Sok Kim
Richard S. Muller
1990
A miniature diaphragm microphone having sensitivity to acoustic signals at the level of conversational speech has successfully been integrated with CMOS circuits on a single chip. The microphone is built on 1.4 um thick LPCVD silicon nitride...

Kirt R. Williams

Alumni
Electrical Engineering and Computer Sciences
Professor Richard S. Muller (Advisor)
Ph.D. 1997

Micromachined Hot-Filament Vacuum Devices

Kirt R. Williams
Richard S. Muller
1997
We describe investigations on micromachined hot-filament vacuum devices, which are electronic devices made by micromachining an ohmically heated tungsten filamentthat acts as a source of blackbody-like radiation or of free electrons. The freestanding filaments, which are typically 200-500μm long, 5-20μm wide, and 0.7-2.3μm thick, are suspended over a cavity...

BSAC Researchers Advised by Professor Richard S. Muller