Polycrystalline silicon germanium has recently proven to be a compelling alternative to polysilicon for micromachining. Low temperature fabrication of micromechanical structures is possible, which enables their modular integration with conventional electronics. The deposition and crystallization temperatures are significantly lower than for polysilicon, and low-stress, low-resistivity structural films can be achieved with little or no annealing. Poly-Ge can be used as a hydrogen peroxide-soluble sacrificial layer, so a...