NanoPlasmonics, Microphotonics & Imaging

Research that includes:

  • Polymer, printed optical lenslet arrays
  • Microfluidic tuneable photopolymer lenses
  • Optical switches and planar lightwave MEMS
  • Vertically integrated microconfocal arrays
  • Bio-inspired integration of tuneable polymer optics with imaging electronics

Dehui Zhang

Postdoctoral Researcher
Electrical Engineering and Computer Sciences
Professor Ali Javey (Advisor)

Dehui Zhang is a postdoctoral researcher in Electrical Electrical Engineering and Computer Sciences at the University of California, Berkeley, a postdoctoral researcher at Berkeley Sensor & Actuator Center (BSAC), and a research affiliate in the Materials Science Division at Lawrence Berkeley National Laboratory. He received a Ph.D. in Electrical and Computer Engineering from University of Michigan, Ann Arbor in 2021, and was a postdoctoral researcher at University of California, Los Angeles in 2021-2023. Dehui Zhang joined Javey Research Group in September 2023...

BPNX1025: Intelligent Sensors for Semiconductor Metrology (New Project)

Dehui Zhang
2024

Spectroscopy-based semiconductor metrology is crucial for process development and quality control in IC manufacturing. The current metrology technologies process raw spectral data with software postprocessing, causing additional latency, power consumption, and computer memory budget. This project exploits the machine learning algorithms to train novel intelligent sensors that can both detect and compute, instantaneously giving the desired, ultimate analysis results such as thin film material and thickness.

Project is currently funded by: Federal

BPNX1012: Optimization of Integrated Microlens Couplers for Wafer-Scale Packaging (New Project)

Sirui Tang
2024

Despite the current widespread use of silicon photonics, fiber coupling remains one of the principal challenges in mass production. Integrated microlens couplers (IMCs) have been demonstrated as an efficient, broadband, and polarization-insensitive method for wafer-scale fiber-to-chip coupling, with a previously achieved free-space coupling loss of 0.6 dB. In this project, our objective is to further optimize the performance of IMCs by addressing current sources of loss and fabrication limitations. Potential research directions include optimizing the waveguide for single-mode behavior,...

BPNX1010: Foundry-Compatible Silicon Photonic MEMS Switch (New Project)

Arkadev Roy
2024

Integrated silicon photonic switches can serve as primary building blocks for low-latency, high-bandwidth interconnects for communication in data-intensive scenarios ranging from servers in datacenters to chiplets in multi-chip integrated packages. Our group has been developing MEMS-based large-scale silicon photonic switches which are particularly attractive for their low-loss, high-extinction, and low-power performance as well as sub-microsecond switching speed. Previous demonstrations, although fully compatible with CMOS foundries, relied upon a custom fabrication stack. The goal of the...

BPN955: Nanoplasmonic Biosensing

Kamyar Behrouzi
2024

Access to affordable and user-friendly biosensors is crucial for advancing global healthcare. While lateral flow immunoassays have been the primary solution for decades, their limited sensitivity and suboptimal sample utilization present challenges. This project represents a systematic progression towards developing economically viable biosensors with heightened sensitivity, covering a range of diseases from viral infections to cancer. By integrating nanoplasmonics to induce visually perceptible signals and harnessing the coffee ring effect for protein pre-concentration, we achieved...

BPN751: Large-Scale Silicon Photonic MEMS Switch with Sub-Microsecond Response Time

Johannes Henriksson
Jianheng Luo
2023

We developed a new architecture suitable for building a large-scale optical switch with fast response time. We have demonstrated switches with a scale of 240x240 and speed of sub microsecond using our new architecture. The switch architecture consists of an optical crossbar network with MEMS-actuated couplers and is implemented on a silicon photonics platform. To our knowledge this is the largest monolithic switch, and the largest silicon photonic integrated circuit, reported to date. The passive matrix architecture of our switch is fundamentally more scalable than that of multistage...

BPN882: An Ultra-Thin Molecular Imaging Skin for Intraoperative Cancer Detection Using Time-Resolved CMOS Sensors

Hossein Najafi
Mekhail Anwar
2021

Successful treatment of cancer requires targeted and individualized treatment, and subsequently an assessment of the state of the tumor being examined, both gross and microscopic, however oncologists have no method of identifying microscopic tumor in the patient. This results in tumor cells being left behind in patients undergoing surgery. Currently, the only way to determine the presence of any microscopic residual is to examine the excised tumor, stained with a proper marker, under a microscope, which only adds to the complexity and length of the surgery and treatment. The two current...

Large-scale Silicon Photonics Focal Plane Switch Array for Optical Beam Steering

Xiaosheng Zhang
Kyungmok Kwon
Johannes Henriksson
Jianheng Luo
Ming C. Wu
2021

We report on 128×128-element two-dimensional silicon photonics focal plane switch arrays with microelectromechanical-system optical switches for random-access optical beam steering. A 70°×70° field-of-view and sub-MHz steering speed are experimentally demonstrated.

A Large-Scale Microelectromechanical-Systems-Based Silicon Photonics LiDAR

Xiaosheng Zhang
Kyungmok Kwon
Johannes Henriksson
Jianheng Luo
Ming C. Wu
2022

Three-dimensional (3D) imaging sensors allow machines to perceive, map and interact with the surrounding world1. The size of light detection and ranging (LiDAR) devices is often limited by mechanical scanners. Focal plane array-based 3D sensors are promising candidates for solid-state LiDARs because they allow electronic scanning without mechanical moving parts. However, their resolutions have been limited to 512 pixels or smaller2. In this paper, we report on a 16,384-pixel LiDAR with a wide field of view (FoV, 70° × 70°), a fine addressing resolution (0.6° × 0.6°), a narrow beam...

NT20: Integration of PLC with MEMS for Telecommunications

J Provine
2004

This project seeks to integrate MEMS and Planar Lightwave Circuits (PLC), both traditional and composed of Photonic Crystal, to create novel monolithic systems for telecommunication. Specific devices are under design and their functionality will be incrementally verified while fabrication and integration technologies are being developed.

Project end date: 08/18/04