Bernhard Boser (Advisor)

Mitchell Kline

Alumni
Electrical Engineering and Computer Sciences
Professor Bernhard E. Boser (Advisor)
Ph.D. 2013, PostDoc 2014

Joshua Kay

Alumni
Electrical Engineering and Computer Sciences
Professor Bernhard E. Boser (Advisor)
M.S. 2017

Zhaoyi Kang

Alumni
Electrical Engineering and Computer Sciences
Professor Bernhard E. Boser (Advisor)
M.S. 2011

Lisen Wang

Alumni
Professor Bernhard E. Boser (Advisor)
PostDoc 2008

Kaveh Gharehbaghi

Alumni
Professor Bernhard E. Boser (Advisor)
PostDoc 2019

Simone Gambini

Alumni
Professor Bernhard E. Boser (Advisor)
PostDoc 2012

Ali Darvishian

Alumni
Professor Bernhard E. Boser (Advisor)
PostDoc 2020

Mekhail Anwar

Alumni
Professor Bernhard E. Boser (Advisor)
PostDoc 2014

Design Considerations for CMOS-Integrated Hall-effect Magnetic Bead Detectors for Biosensor Applications

Karl Skucha
Bernhard E. Boser
Ming C. Wu
Luke P. Lee
2012

This dissertation presents a design methodology for on-chip magnetic bead label detectors based on Hall-effect sensors to be used for biosensor applications. Signal errors caused by the label-binding process and other factors that place constraints on the minimum detector area are quantified and adjusted to meet assay accuracy standards. The methodology is demonstrated by designing an 8,192 element Hall sensor array implemented in a commercial 0.18 μm CMOS process with single mask post-processing. The array can quantify a one percent surface coverage of 2.8 μm beads in thirty seconds...

Piezoelectric Micromachined Ultrasonic Transducers for Ultrasonic Fingerprint Sensors

Joy (Xiaoyue) Jiang
David A. Horsley
Liwei Lin
Bernhard E. Boser
George C. Johnson
2018

A variety of physical mechanisms have been exploited to capture electronic images of a human fingerprint, including optical, capacitive, pressure, and acoustic mechanisms. Compared to other technologies, ultrasonic fingerprint sensors have two major advantages (1) they are insensitive to contamination and moisture on the finger (2) they have the ability to measure images at multiple depths hundreds of microns from the sensor surface. With the maturity of the thin film piezoelectric materials technology and MEMS-CMOS eutectic wafer-bonding process, piezoelectric micromachined...